Join us for a two-hour seminar, led by experts in the field, to discuss in-situ tensile testing in the transmission and scanning electron microscopes.
Thursday, June 25 – 2PM CEST and 3PM PDT
The tensile test is the standard mechanical test for determining Young’s modulus, yield strength, work hardening, and more. These tests are more challenging than their peers to perform at nano- and micromechanical length scales, requiring advanced sample preparation and positioning. In 2006, researchers using Bruker’s Hysitron Picoindenter tools were the first to enable in-situ quantitative testing, originally in the TEM, followed shortly in the SEM. Indentation, compression, and tensile modes as standard on the original Hysitron PI 95 led to a wave of in-situ publications. In this seminar, the focus is on re-creating a uniaxial strain using both direct pull with tensile actuation of the transducer, and the patented Push-to-Pull MEMS chip.
We welcome these experts to present data from the past, present, and future of in-situ tensile testing in the SEM and TEM.
- In-Situ Tensile Testing in a TEM: Both Measuring and Observing Changes in Local Structure
- In-Situ TEM Failures in Fatigue and Other Extreme Environments
- A Practical Demonstration of In-Situ SEM Direct Pull Tension: Step-by-Step Sample Preparation and Testing of a Duplex Steel
Dr. Andrew M. Minor – Professor
Dr. Zhiwei Shan – Director
Dr. Khalid Hattar – Principle Member of the Technical Staff
Dr. Eric Hintsala – Applications Scientist